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Furukawa Electric
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Products & Services
Materials
Furukawa Electric
Non-UV Tape for Bumped Wafer Back Grinding
CP9206M-430
Non-UV Tape for Wafer Back Grinding
CP9003B-205B
UV Tape for Thin Wafer Dicing
UC3044M-110B
UV Tape for Package Dicing
FC-217M-170
UV Tape for Optical Product
UC3160M-95
DAF for Die to Substrate
AFN603
DAF for Die to Die
AFN303
DAF for FOW
AFN601