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Wafer Level Molding System
SWM-90 Auto
SWM-90 Auto
Description：
Fully automatic wafer molding system
Suitable for batch production of wafer level molding
Equipped with automatic loading and unloading modules and rich optional functions; Through reliable structural design, stable feeding and unloading transportation is achieved; This machine can achieve various packaging forms of 12 inch wafers and panels according to customers’ selection.
Equipment Features
Equipped with independent control of 4 servo motors, achieving micrometer level parallelism while maintaining 8-speed compression molding, achieving uniform resin flow in the mold cavity and achieving ultra-high WLP packaging quality.
Molding Type
• Granule compound
• Liquid compound
• Sheet compound
Equipment Specifications
Standard Unit
• Press module
• Cavity vacuum
• Top film unit
• Carrier bottom vacuum
• Mold chase
Option
• Bottom film unit
• Transformer 380V→200V
• Mold temperature monitor
• Others
Package Type
• Fan-In WLP, Fan-Out WLP, 2.5D WLP, 3D WLP, SIP WLP, WLCSP etc.
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