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Fully Automatic
Tape Laminator
EXL2-1200 F1/F2 series
Tape Laminator
EXL2-1200 F1/F2 series
商品簡述：
- Handles wafer diameters up to 200mm(8 inch).
- Two kinds of cutting methods with Notch Cutting - Digital Cutter Blade, Class4 CO2 Laser.
- H.D.C.R(Highly Digital Control Recipe) Availlable .
- Running Thin wafer Capability - Ground or Re-work wafer.
- Adjustment Free Optical Wafer Alignment.
- Adjustment Free Major/Minor Flat or Notch.