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Wafer Level Solder Ball Mounter
AIP-300BMR
AIP-300BMR
商品簡述：
Key Features
Wafer Micro Ball Printing & Ball Repair System
* Ensure and deliver mass-production by 40um solder ball
* New rotary head provides high throughput. (25% improved vs Conventional head)
* On the fly inspection is capable for large packages without any limitation.
Basic Specifications
更多產品資料......
Wafer Micro Ball Printing & Ball Repair System
* Ensure and deliver mass-production by 40um solder ball
* New rotary head provides high throughput. (25% improved vs Conventional head)
* On the fly inspection is capable for large packages without any limitation.
Basic Specifications
| Items | Specifications |
|---|---|
| Line Configuration | Flux / Ball printer / Inspection & Repair |
| Wafer Transportation | Robot Tranfer or Clamping Carrier |
| Throughput（Tact Time） | 65sec |
| Applicable wafer size | Max. 12" (300mm) |
| Applicable ball diameter | 40 - 500(μｍ) |
| Alignment repeatability | < ±10um |
| Missing rate (No ball ratio) | < 20ppm |
| Inspection method | On the fly inspection (Non-stop imaging) |
| Applicable max. unit size | 120.0 × 120.0(mm) |
| Inspection time (Reference) | Approx 16sec./ 1/4 wafer(144unit/wafer) |
| Repair | With Flux W/O Flux Available |
| Ball remove (for extra ball) | Available |