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Ultrasonic Solution
Dual Flip Chip Bonder
AMB-6000F
Dual Flip Chip Bonder
AMB-6000F
Description：
- Ultra-sonic Solution with High Speed, Accuracy and Reliabilty for your Flip Chip Application
- Bonding System
- Speed : 580 msec
- Method : Ultra-sonic Thermal Compression
- Force : Force Control by Voice Coil Motor
- Wafer Handling System
- Wafer Expansion Control by Motor
- Ejector Height Control by Motor
- Substrate Handling System
- Pre Heating Zone
- Dual Magazine In/Out System
- Vision & Control System
- PC Based System Control
- Easy Operation
- Options
- Barcode Reader
- SECS I & II Communication
- UPS/VSP
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