Key Features
•​In response to the increasingly stringent requirements in both advanced technology and product variety, ​PAL formed an association in early 2002 with a well-known electroplating equipment manufacturer in Japan,​​Marunaka Kogyo Co Ltd, to further develop and promote its Vertical Continuous Plating Equipment (MCP-PAL).
•Marunaka has obtained several patents in this MCP-PAL equipment.
•Through continuous research, development and enhancement work of PAL engineers,​ MCP-PAL offers excellent design features, high quality plating performance and outstanding reliability.
•Excellent Plating Distribution/Through Hole Plating/Via Filling
•Consistent Panel-to-Panel Plating Quality
•Capable of Panel, Pattern and other Plating Processes
•Can be incorporated with Soluble or Insoluble Anodes
•Able to handle Typical Panel Thickness ranges from 0.06mm to 3.2mm
• Auto Load/Unload Systems, Auto Cathode Shielding
•In-line Rack Strip Minimal Fume Exhaust
•Easy Operation and Maintenance Less Space Requirement Lower Operation Costs