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Vacuum Soldering Systems
c.VACUNITE 300|
c.VACUNITE 180
c.VACUNITE 300|
c.VACUNITE 180
Description：
The centrotherm c.VACUNITE 300 and c.VACUNITE 180 vacuum soldering systems are ideally suited for high volume production facilities with various materials at up to 650°C.
The integrated heating and cooling plates can be individually controlled. With c.VACUNITE 300 and c.VACUNITE 180, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
The system is ideally suited for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). Wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints are optionally available. Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.
Applications : Advanced Packaging, Power Semiconductors, Sealing, Soldering
Features
Process temperature up to 650°C
Excellent temperature uniformity
Heating ramp up to 40 K/min
Cooling rate up to 150 K/min
Vacuum level up to 10-1 mbar
Very high throughput
Large process area
c.VACUNITE 180: 0.66 m2 (1 in.2)
c.VACUNITE 300: 1.1 m2 (1.7 in.2)
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