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Wafer Grinding Wheels
Description:
- Here is a wafer fine grinding example of 8" & 12" Si wafers by #4000/#6000 wafer grinding wheels in-house and by customer.
- The result indicating lifetime of KINIK wafer grinding wheels with less tip wear is longer than that of competitor's.
Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325～#1000 and #2000～#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.
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