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Fully Automated Wafer Level
X-Ray Inspection System
TUX-8000
X-Ray Inspection System
TUX-8000
Description：
- For micro bump and TSV inspection
resolution and higher brightness contrast image than ever.
- Can be realize overwhelming geometric magnification to inspect micro meter level void of
micro bump
- 5 different size focus
(0.4, 0.6, 1.0, 2.0, 3.0um focus)
- Stable and reliable Source
- Short snap time per scan can be realize fast inspection time and minimize wafer damage
- Easy Operation with touch panel-Easy to start inspection, easy to setup each inspection recipe
- Inspection for
- Diameter of bump
- Void percentage of bump
- Short between bumps
- Shape of bump
- Supported SECS/GEM, OHT...etc.