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Wafer Inspection and Metrology
WI-2280
WI-2280
商品簡述：
The WI-2280 automated optical inspection and metrology systems inspect and measure microelectronic devices on a variety of wafer substrates, supporting wafer-level packaging and post-dicing quality control for LED, VCSEL and other integrated circuit applications. It is capable of handling whole wafers from 2 to 8 inches and diced wafers on FFC or a hoop ring. With both inspection and 2D metrology capability, the WI-2280 systems provide feedback on the wafer surface quality; wafer dicing quality; and, critical dimension and overlay quality of bumps, pads and copper pillars. The systems are designed with IRIS (ICOS Review and Classification Software), which offers defect review and reclassification, for faster yield learning and improved process control.
Applications :
Process monitor, Outgoing Quality Control (OQC), Tool monitor
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