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Fully Automatic FCBGA
Solder Ball Mount System
Aurigin au901c
Solder Ball Mount System
Aurigin au901c
商品簡述：
Key Features :
- Large Panel Carrier : Upto 160x310mm.
- Fine Pitch : 0.2 mm Ball Diameter.
- Sphere Handling : Proprietary design eliminates damages to solder spheres.
- Product Setup : Rapid product change-over with quick-change product.
- Supported : SECS/GEM200, GEM300 Standard and WebAPI.
- Certified : SEMI S2/S8.