Die Sorting and Inspection Systems
The ICOS™ F260 die sorting and inspection system provides high performance die sorting with integrated, fully automated inspection of diced wafer-level packages. The ICOS F260 system includes the new shortwave IR inspection module Gaminae, which provides reliable detection of invisible laser groove, hairline and sidewall cracks, all of which are killer defects for advanced fan-in wafer-level packages, memory and bare dies. The Gaminae module combines optical and IR side inspection to provide an efficient inspection flow with high sensitivity to multiple defect types for maximum die sorting accuracy. The ICOS F260 system is highly flexible and supports many workflows, including wafer-to-tape and tape-to-tape. Its fast conversions between different configurations, dual station flipper, automatic calibrations and precision die pickup enhance tool value in high volume manufacturing environments.
Applications
Die sorting, Outgoing Quality Control (OQC), Known Good Die (KGD), Unit Level Traceability (ULT)
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