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Fully Automatic
Tape Remover System
DXR2-800X series
Tape Remover System
DXR2-800X series
Description：
- Handles wafer diameters up to 200mm(8 inch)
- Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. Further information… Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal.
- H.D.C.R(Highly Digital Control Recipe) Availlable.
- TTS Unique Inline UV Technology and Longer UV Lamp lifetime.
- Running Ultra Thin Wafer/ High Bump Wafer Capabity.
- High Power Multi Wave UV Irradiator.(OPTION)