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  • Teikoku Taping System
Semiautomatic<BR>Tape Remover<BR>SXR-1200X series
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Semiautomatic
Tape Remover
SXR-1200X series
Description:
Key Features
  • Applied wafer sizes : Up to 300mm.(12 inch and required appropriate wafer table)
  • Quick conversion : conversion time less than 1 min. No adjustment required(Less than 5 min)
  • Load and unload capacity : Manually loaded and unloaded with stainless porous chuck.
  • General description wafer will be placed and position secured by hand. Need start trigger by operator to start the process. lignment must be made manually by the Operator on stainless porouschuck wafer vacuum holding will be made automatically. tape removing process will be completed automatically. completed Wafer will be conveyed to its loading position. only single mode process is available.
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Jipal Corporation

 Hsinchu City, Taiwan, R.O.C. 
 TEL : 886-3-5725325 
 Email : sales@jipal.com 
 


Contact Us  

 Head Office & Global Locations 

Products & Services

 Semiconductors 
 Materials 
 Photovoltaics 
 TEST & PCBA 


 News & Events 

 

About Jipal

 Company Information 
 Company History 
 Core Values 
 Affiliate Partners 
 Awards & Recognitions

 
 

 
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