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SiP CSP Laser Trench
SCM-A300
SCM-A300
商品简述：
- Process Application : Device : SiP / Panel package, Compound trench, Laser cutting
- Laser type : UV Laser
- Machine Capacity :
- Compound thickness : up to 2.0mm
- Material warpage handing : up to 7.0mm
- Accuracy : <+/-10um CPK>1.67
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