Key Features

​•In response to the increasingly stringent requirements in both advanced technology and product variety, ​PAL formed an association in early 2002 with a well-known electroplating equipment manufacturer in Japan,​​Marunaka Kogyo Co Ltd, to further develop and promote its Vertical Continuous Plating Equipment (MCP-PAL).

•Marunaka has obtained several patents in this MCP-PAL equipment.

•Through continuous research, development and enhancement work of PAL engineers,​ MCP-PAL offers excellent design features, high quality plating performance and outstanding reliability.

•Excellent Plating Distribution/Through Hole Plating/Via Filling

•Consistent Panel-to-Panel Plating Quality

•Capable of Panel, Pattern and other Plating Processes

•Can be incorporated with Soluble or Insoluble Anodes

•Able to handle Typical Panel Thickness ranges from 0.06mm to 3.2mm

• Auto Load/Unload Systems, Auto Cathode Shielding

•In-line Rack Strip Minimal Fume Exhaust

•Easy Operation and Maintenance Less Space Requirement Lower Operation Costs