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Wafer Level Φ30um Solder Ball Mounter
商品簡述：
Key Features
Wafer Level 30um Solder Ball Mounting System (Patented)
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Wafer Level 30um Solder Ball Mounting System (Patented)
- Realized Uniform Flux Coating enabling Ultra Fine Pitch by Inkjet Technology.
- Contributed to Stable Ball Mounting and Productivity Improvement by High-Speed Rotary Head.
- Enabled High-Speed Inspection and Repair by“On the Fly Inspection”as Non-Stop Continuous Inspection.
- Total Solution contributing to Yield and Productivity Improvement for Microscopic Solder Ball Mounting Process with Ultra Fine Pitch.
- Flux Coating : Inkjet Coating without using conventional Stencil Mask
- Ball Mounting : New Rotary Head to provide High Throughput
- Inspection & Repair : Continuous High-Speed Inspection (On the Fly),
- Capable for □120mm Unit size Inspection & Repair
- Not required Stencil mask for Flux printing process and Flux Usage to be improved
| No. | Items | Specifications |
|---|---|---|
| 1 | Work Size | Wafer : Max. 12“ (φ300mm) |
| 2 | Work Type | Wafer (WLCSP, FOWLP, etc.) |
| 3 | Applied Ball Diameter | 30um - 300um |
| 4 | Throughput | 65 UPH |
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