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Wafer Level Solder Ball Mounter
ABM-04G-WFS / ABM-04S-WFS
ABM-04G-WFS / ABM-04S-WFS
Description：
Flux Printing
・Reduced Flux Bleeding by Gap Printing
・Stabled Transfer Position by One-direction Printing Mechanism
・Minimized Cleaning Frequency
Ball Mounting
・New Infinity Head (Triple Type Rotary & Closed Type Squeegee)
・Higher Throughput
・Minimized Sweeping Frequency (1/3 compared with the conventional type)
・ Increased Solder Ball Use Efficiency (1/2 compared with the conventional type)
Application : Wafer such as WLCSP, FOWLP, etc.
Inspection & Repair : Enabled to systematize Ball Mounting System with Inspection & Repair Equipment
Basic Specifications
| No. | Items | Specifications | |
|---|---|---|---|
| ABM-04G-WFS | ABM-04S-WFS | ||
| 1 | Wafer Size | Max. 12“ (φ300mm) | Max. 12“ (φ300mm) |
| 2 | Handling System | Load port | Load port |
| 3 | Applicable Ball Size | 40um～300um | 80um～300um |
| 4 | Alignment Accuracy | ＜±10um | ＜±15um |
| 5 | Flux Printing | Gap Printing | Gap Printing |
| 6 | Ball Mounting | New Infinity Head | New Infinity Head |
| 7 | Ball Missing Rate | ＜20ppm | ＜30ppm |
| 8 | Throughput | > 65UPH | > 40UPH |