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Wafer Level Molding System
SWM-90 MS
SWM-90 MS
Description:
Max.90 tons manual wafer packaging system
Suitable for wafer level packaging laboratories or small batch production!
Equipment Features
Equipped with independent control of 4 servo motors, achieving micrometer level parallelism while maintaining 8-speed compression molding, achieving uniform resin flow in the mold cavity and achieving ultra-high WLP packaging.
Molding Type
• Granule compound
• Liquid compound
• Sheet compound
Equipment Specifications
Standard Unit
• Press module
• Cavity vacuum
• Top film unit
• Carrier bottom vacuum
• Mold chase
Option
• Bottom film unit
• Transformer 380V→200V
• Mold temperature monitor
• Others
Package Type
• Fan-In WLP, Fan-Out WLP, 2.5D WLP, 3D WLP, SIP WLP, WLCSP etc.
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