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Wafer Backside Marking System
WBM320GDF
WBM320GDF
Description：
- Marking Acc: ±50um as marking position accuracy
- High speed and warpage compensation
- Optimized wafer handling system
- Built-in APC system for power monitoring
- Build-in high accuracy vision system for alignment and scanner calibration
- Super high accuracy AOl system.
- IMPW wafer is available and easy to build recipe
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