MCP Vertical Continuous Plating System
商品简述:
Key Features
•In response to the increasingly stringent requirements in both advanced technology and product variety, PAL formed an association in early 2002 with a well-known electroplating equipment manufacturer in Japan,Marunaka Kogyo Co Ltd, to further develop and promote its Vertical Continuous Plating Equipment (MCP-PAL).
•Marunaka has obtained several patents in this MCP-PAL equipment.
•Through continuous research, development and enhancement work of PAL engineers, MCP-PAL offers excellent design features, high quality plating performance and outstanding reliability.
•Excellent Plating Distribution/Through Hole Plating/Via Filling
•Consistent Panel-to-Panel Plating Quality
•Capable of Panel, Pattern and other Plating Processes
•Can be incorporated with Soluble or Insoluble Anodes
•Able to handle Typical Panel Thickness ranges from 0.06mm to 3.2mm
• Auto Load/Unload Systems, Auto Cathode Shielding
•In-line Rack Strip Minimal Fume Exhaust
•Easy Operation and Maintenance Less Space Requirement Lower Operation Costs
More...... •In response to the increasingly stringent requirements in both advanced technology and product variety, PAL formed an association in early 2002 with a well-known electroplating equipment manufacturer in Japan,Marunaka Kogyo Co Ltd, to further develop and promote its Vertical Continuous Plating Equipment (MCP-PAL).
•Marunaka has obtained several patents in this MCP-PAL equipment.
•Through continuous research, development and enhancement work of PAL engineers, MCP-PAL offers excellent design features, high quality plating performance and outstanding reliability.
•Excellent Plating Distribution/Through Hole Plating/Via Filling
•Consistent Panel-to-Panel Plating Quality
•Capable of Panel, Pattern and other Plating Processes
•Can be incorporated with Soluble or Insoluble Anodes
•Able to handle Typical Panel Thickness ranges from 0.06mm to 3.2mm
• Auto Load/Unload Systems, Auto Cathode Shielding
•In-line Rack Strip Minimal Fume Exhaust
•Easy Operation and Maintenance Less Space Requirement Lower Operation Costs