Fully Automated Wafer Grinder
GNX200B
GNX200B
Description:
- Own Developed Downfeed Grinding + Index Wafer Transfer Mechanism Targeting Wafer Breakage ZERO
- High Accuracy, High Efficiency Come True on 200mm Wafer.
Hsinchu City, Taiwan, R.O.C.
TEL : 886-3-5725325
Email : sales@jipal.com