Non-UV Tape for Wafer Back Grinding
CP9003B-205B
CP9003B-205B
Description:
- High Adhesive Strength and Good Absorbing Property prevents Seepage
- Recommending of Heat De-Taping for Easy De-Taping
Hsinchu City, Taiwan, R.O.C.
TEL : 886-3-5725325
Email : sales@jipal.com