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Hybrid Silver Epoxy Die Attach-Non Conductive Paste
(ONLY FOR SOUTHEAST ASIA)
(ONLY FOR SOUTHEAST ASIA)
| Non-Conductive paste for packages | ||||
| Product | Leadframe Type | Die size | PKG | Features |
| (mm2) | ||||
| 403NCA | Cu/Ag/PPF/ Substrate |
1*1 ~ 10*10 | SOP/DFN/TO | Low volatility. MSL 1. Excellent performance Excellent performance of electric insulation. Good adhesion. Low stress. |
| DIP/QFN/BGA | ||||
| LQFP/QFP | ||||
| 403NCA-MH | Cu/Ag/PPF LF | 0.5*0.5 ~ 3*3 | SOP/DFN/ TO/DIP |
Low volatility. MSL 1. Excellent performance of electric insulation. Good adhesion. Excellent die shear strength of high temp. |
| 403LEF | Cu/Ag/PPF LF | 0.3*0.3 ~ 2*2 | SOP/DFN/ TO/DIP |
MSL 3. Excellent performance and good adhesion for electric insulation. |
| 403NCB | Cu/Ag/PPF/ Substrate |
1*1 ~ 3*3 | SOP/DFN/ TO/DIP |
MSL 3. Excellent performance and good adhesion for electric insulation. |