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Hybrid Silver Epoxy Die Attach-Conductive Paste
(ONLY FOR SOUTHEAST ASIA)
(ONLY FOR SOUTHEAST ASIA)
| Conductive paste for packages | ||||
| Product | Leadframe Type | Die size | PKG | Features |
| (mm2) | ||||
| 403HEC | Cu/Ag/PPF LF | 1*1 ~ 3*3 | SOP/DFN/TO/DIP | MSL 3. High Electrical Conductivity for Mosfet device. Low volatility. High adhesion. |
| 403MOS | Ag/PPF LF | 0.3*0.3 ~ 2*2 | SOP/DFN/SOT/DIP | MSL 1. High Electrical Conductivity for Mosfet device. High Tg. Low volatility. Excellent die shear strength of high temperature on small die. |
| 403MSC | Cu/Ag/PPF LF | 0.3*0.3 ~ 3*3 | SOP/DFN/TO/ | MSL 3. High Electrical Conductivity for Mosfet device. High Electrical Conductivity. Low volatility. Fast curing |
| DIP/SOT/SOD | ||||
| 503PD-3 | Ag/Cu/PPF LF | 0.5*0.5 ~ 3*3 | SOP/DFN/SOT/DIP | MSL 1. High Electrical Conductivity for Mosfet device. High Tg. Low volatility. High peeling strength. |
| 503HTC | Cu/Ag/PPF LF | 1*1 ~ 3*3 | SOP/DFN/TO/DIP | MSL1. High Thermal Conductivity. High Electrical Conductivity. |
| 403Melt | Cu/Ag/PPF LF | 0.5*0.5 ~ 3*3 | SOP/DFN/TO/DIP | MSL 1. High content of Silver, Extremely low Contact Resistance, High Electrical Conductivity. |
| 403MS | Cu/Ag/PPF/ Substrate | 1*1 ~ 10*10 | QFN/LQFP /QFP/BGA | MSL 1. Suitable for all devices. Low volatility. High peeling strength. |
| 403LS | Cu/Ag/PPF/ Substrate | 2*2 ~ 10*10 | QFN/LQFP /QFP/BGA | MSL 1. Low cost version of 403MS. Low volatility. High adhesion. Low stress. |
| 403EMS | Cu/Ag/ Pd/Ni LF | ＜1*1 | LED | High adhesion. High Electrical Conductivity. |