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Hybrid Silver Epoxy Die Attach-Conductive Paste<BR>(ONLY FOR SOUTHEAST ASIA)
1 / 1
  • Hybrid Silver Epoxy Die Attach-Conductive Paste<BR>(ONLY FOR SOUTHEAST ASIA)
Hybrid Silver Epoxy Die Attach-Conductive Paste
(ONLY FOR SOUTHEAST ASIA)
 
Conductive paste for packages
Product Leadframe Type Die size PKG Features
    (mm2)    
403HEC Cu/Ag/PPF LF 1*1 ~ 3*3 SOP/DFN/TO/DIP MSL 3. High Electrical Conductivity for Mosfet device. Low volatility. High adhesion.
403MOS Ag/PPF LF 0.3*0.3 ~ 2*2 SOP/DFN/SOT/DIP MSL 1. High Electrical Conductivity for Mosfet device. High Tg. Low volatility. Excellent die shear strength of high temperature on small die.
403MSC  Cu/Ag/PPF LF  0.3*0.3 ~ 3*3  SOP/DFN/TO/ MSL 3. High Electrical Conductivity for Mosfet device. High Electrical Conductivity. Low volatility. Fast curing
      DIP/SOT/SOD  
503PD-3 Ag/Cu/PPF LF 0.5*0.5 ~ 3*3 SOP/DFN/SOT/DIP MSL 1. High Electrical Conductivity for Mosfet device. High Tg. Low volatility. High peeling strength.
503HTC Cu/Ag/PPF LF 1*1 ~ 3*3 SOP/DFN/TO/DIP MSL1. High Thermal Conductivity. High Electrical Conductivity.
403Melt Cu/Ag/PPF LF 0.5*0.5 ~ 3*3 SOP/DFN/TO/DIP MSL 1. High content of Silver, Extremely low Contact Resistance, High Electrical Conductivity.
403MS Cu/Ag/PPF/  Substrate 1*1 ~ 10*10 QFN/LQFP /QFP/BGA MSL 1. Suitable for all devices. Low volatility. High peeling strength.
403LS Cu/Ag/PPF/  Substrate 2*2 ~ 10*10 QFN/LQFP /QFP/BGA MSL 1. Low cost version of 403MS. Low volatility. High adhesion. Low stress.
403EMS  Cu/Ag/ Pd/Ni LF  <1*1  LED  High adhesion. High Electrical Conductivity. 


 
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Jipal Corporation

 Hsinchu City, Taiwan, R.O.C. 
 TEL : 886-3-5725325 
 Email : sales@jipal.com 
 


Contact Us  

 Head Office & Global Locations 

Products & Services

 Semiconductors 
 Materials 
 Photovoltaics 
 TEST & PCBA 


 News & Events 

 

About Jipal

 Company Information 
 Company History 
 Core Values 
 Affiliate Partners 
 Awards & Recognitions

 
 

 
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