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Fully Automatic BGA/CSP
Solder Ball Mount System
Aurigin au800plus
Solder Ball Mount System
Aurigin au800plus
商品簡述：
Key Features :
- Sphere Sizes / Pitch : as small as 0.13mm diameter.
- Sphere Handling : Proprietary design eliminates damages to solder spheres.
- Product Setup : Rapid product change-over with quick-change product tooling.
- Supported : SECS/GEM200, GEM300 Standard and WebAPI.
- Certified : SEMI S2/S8.