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Non-UV Tape for Wafer Back Grinding<BR>CP9003B-205B
1 / 1
Non-UV Tape for Wafer Back Grinding
CP9003B-205B
Description：
Key Features
  • High Adhesive Strength and Good Absorbing Property prevents Seepage
  • Recommending of Heat De-Taping for Easy De-Taping 
More......
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Jipal Corporation

 Hsinchu City, Taiwan, R.O.C. 
 TEL : 886-3-5725325 
 Email : sales@jipal.com 
 

Contact Us  

 Head Office & Global Locations 

Products & Services

 Semiconductors 
 Materials 
 Photovoltaics 
 TEST & PCBA 

 News & Events 

 

About Jipal

 Company Information 
 Company History 
 Core Values 
 Affiliate Partners 
 Awards & Recognitions
 
 

 
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